HDI PCB High Density Interconnected 8 Layer Black Solder Mask
Main Features:
1 8 Layer HDI PCB, high density printed circuit board.
2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM
3 Buried holes: L4-L7 0.2MM.
4 Via holes: L1-L8 0.2MM.
5 PCB thickness is 1.0mm.
6 Min BGA ball size is 10mil.
7 Min line space and width is 2.5/2.5mil.
8 Material is FR4 Substrate, tg180 degree
9 S1000-2 material used.
S1000-2 Material data sheet:
| S1000-2 |
| Items |
Method |
Condition |
Unit |
Typical Value |
| Tg |
IPC-TM-650 2.4.25 |
DSC |
℃ |
180 |
| IPC-TM-650 2.4.24.4 |
DMA |
℃ |
185 |
| Td |
IPC-TM-650 2.4.24.6 |
5% wt. loss |
℃ |
345 |
| CTE (Z-axis) |
IPC-TM-650 2.4.24 |
Before Tg |
ppm/℃ |
45 |
| After Tg |
ppm/℃ |
220 |
| 50-260℃ |
% |
2.8 |
| T260 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
60 |
| T288 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
20 |
| T300 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
5 |
| Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
-- |
100S No Delamination |
| Volume Resistivity |
IPC-TM-650 2.5.17.1 |
After moisture resistance |
MΩ.cm |
2.2 x 108 |
| E-24/125 |
MΩ.cm |
4.5 x 106 |
| Surface Resistivity |
IPC-TM-650 2.5.17.1 |
After moisture resistance |
MΩ |
7.9 x 107 |
| E-24/125 |
MΩ |
1.7 x 106 |
| Arc Resistance |
IPC-TM-650 2.5.1 |
D-48/50+D-4/23 |
s |
100 |
| Dielectric Breakdown |
IPC-TM-650 2.5.6 |
D-48/50+D-4/23 |
kV |
63 |
| Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 |
1MHz |
-- |
4.8 |
| IEC 61189-2-721 |
10GHz |
-- |
— |
| Dissipation Factor (Df) |
IPC-TM-650 2.5.5.9 |
1MHz |
-- |
0.013 |
| IEC 61189-2-721 |
10GHz |
-- |
— |
| Peel Strength (1Oz HTE copper foil) |
IPC-TM-650 2.4.8 |
A |
N/mm |
— |
| After thermal Stress 288℃,10s |
N/mm |
1.38 |
| 125℃ |
N/mm |
1.07 |
| Flexural Strength |
LW |
IPC-TM-650 2.4.4 |
A |
MPa |
562 |
| CW |
IPC-TM-650 2.4.4 |
A |
MPa |
518 |
| Water Absorption |
IPC-TM-650 2.6.2.1 |
E-1/105+D-24/23 |
% |
0.1 |
| CTI |
IEC60112 |
A |
Rating |
PLC 3 |
| Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
| E-24/125 |
Rating |
V-0 |
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
Product Tags:
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8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask Images
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